Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

This PDF book is become immediate popular in Technology & Engineering genre. Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture is written by famous author E-H Wong and Ready to Download in ePUB, PDF or Kindle formats. Released by Woodhead Publishing in 2015-05-23. Click Download Book button to get book file and read directly from your devices. Here is a quick description and cover image of Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture book.

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
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Publisher : Woodhead Publishing
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ISBN : 9780857099112
Pages : 482 pages
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Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture by E-H Wong Book PDF Summary

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study


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Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
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Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture PDF book is popular Technology & Engineering book written by E-H Wong,Y.-W. Mai. The book was released by Woodhead Publishing in 23 May 2015 with total hardcover pages 482. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough

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Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture PDF book is popular Technology & Engineering book written by E-H Wong,Y.-W. Mai. The book was released by Woodhead Publishing in 05 June 2015 with total hardcover pages 482. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough

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